MTP10N10EL
Preferred Device
Power MOSFET
10 A, 100 V, Logic Level, N?Channel TO?220
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. The energy efficient design also
offers a drain?to?source diode with a fast recovery time. Designed for
low voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Features
? Avalanche Energy Specified
? Source?to?Drain Diode Recovery Time Comparable to a Discrete
http://onsemi.com
10 A, 100 V
R DS(on) = 0.22 W
N?Channel
D
?
?
?
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
I DSS and V DS(on) Specified at Elevated Temperature
Pb?Free Package is Available
G
S
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
MARKING DIAGRAM
Rating
Symbol
Value
Unit
& PIN ASSIGNMENT
Drain?to?Source Voltage
Drain?to?Gate Voltage (R GS = 1.0 M W )
V DSS
V DGR
100
100
Vdc
Vdc
4
4
Drain
Gate?to?Source Voltage
? Continuous
? Non?Repetitive (t p ≤ 10 ms)
V GS
V GSM
± 15
± 20
Vdc
Vpk
Drain Current
? Continuous @ T C = 25 ° C
? Continuous @ T C = 100 ° C
? Single Pulse (t p ≤ 10 m s)
I D
I D
I DM
10
6.0
35
Adc
Apk
1
2
3
TO?220AB
CASE 221A
STYLE 5
MTP10N10EL
LLYWW
Total Power Dissipation @ T C = 25 ° C
Derate above 25 ° C
Total Power Dissipation @ T C = 25 ° C
(Note 1)
Operating and Storage Temperature
Range
P D
T J , T stg
40
0.32
1.75
?55 to
150
Watts
W/ ° C
Watts
° C
MTP10N10EL
1
Gate
2
Drain
= Device Code
3
Source
LL
= Location Code
Single Pulse Drain?to?Source Avalanche
Energy ? Starting T J = 25 ° C
E AS
50
mJ
Y
WW
= Year
= Work Week
(V DD = 25 Vdc, V GS = 5.0 Vdc, Peak
I L = 10 Adc, L = 1.0 mH, R G = 25 W )
Thermal Resistance
? Junction?to?Case °
R q JC
3.13
° C/W
ORDERING INFORMATION
Device Package Shipping
? Junction?to?Ambient
? Junction?to?Ambient (Note 1)
R q JA
R q JA
100
71.4
MTP10N10EL
TO?220AB
50 Units/Rail
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 secs
T L
260
° C
MTP10N10ELG
TO?220AB
(Pb?Free)
50 Units/Rail
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
*For additional information on our Pb?Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
? Semiconductor Components Industries, LLC, 2005
March, 2005 ? Rev. 4
1
Publication Order Number:
MTP10N10EL/D
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